1673-159X

CN 51-1686/N

亚微米SiO2对石膏线膨胀率的影响

The Influence of Submicron Silicon Dioxide on the Linear Thermal Expansion of Plaster Mold

  • 摘要: 通过单因素及正交实验对加水量、亚微米SiO2加入量、硅溶胶加入量进行考察, 得出添加剂对石膏混合料线膨胀率的影响规律, 并用SEM观测亚微米SiO2-石膏型的断面微观结构。结果表明: 在水固比、亚微米SiO2、硅溶胶加入量分别为0.52∶1、4%、3%时, 所获得的石膏型最佳, 其线膨胀率为-1.505%;石膏型的整体结构由硅溶胶和半水石膏晶体形成的网络结构相互交织而成。

     

    Abstract: To acquire the effective of additive amount on the liner thermal expansion of gypsum mixture, the water addition, the submicron silicon dioxide addition and the silica sol addition were inspected through single-factor and orthogonal experiment, and the microstructure of submicron silicon dioxide-gypsum mold was observed by SEM.The results show that the fire shrinkages of the better gypsum mold is 1.505% minus, when the water / powder ratio, the submicron silicon dioxide addition and the silica sol addition are 52%, 4%, 3% respectively; The over-all structure of the gypsum mold is interlaced by the silica sol and network structure.

     

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